更新日期 |
更新类别 |
更新内容 |
|---|---|---|
2026-01-14 |
New device added |
新增MT29F8G08ABACAWP单头 |
2026-01-14 |
New device added |
新增GE51AE3MSL008G0芯片 |
2026-01-14 |
New device added |
新增BWEFMIO16GN929芯片 |
2026-01-13 |
New device added |
新增P25N01GHA芯片 |
2026-01-13 |
New device added |
新增SC95F8572X20芯片 |
2026-01-13 |
Optimized |
解决了GD5F4GQ6REY2G 部分座头烧录不稳定问题 |
2026-01-12 |
New device added |
新增F50D2G41KB芯片 |
2026-01-12 |
New device added |
新增F50L2G41KB芯片 |
2026-01-12 |
New device added |
新增F50D1G41LC芯片 |
2026-01-12 |
New device added |
新增 PUYA PY25Q512HB |
2026-01-09 |
New device added |
新增ASFC4G31M-51BIN芯片 |
2026-01-09 |
New device added |
新增GD5F4GM7REYIGR芯片 |
2026-01-09 |
New device added |
新增 XMC XM25RH128D |
2026-01-09 |
New device added |
新增客户定制THGAMVG8T13BAIL算法 |
2026-01-09 |
New device added |
新增客户定制THGAMSG9T15BAIL算法 |
2026-01-09 |
New device added |
新增 PUYA PY25R128HA |
2026-01-09 |
New device added |
新增GD5F4GM7UEYIGR芯片 |
2026-01-09 |
New device added |
新增GE51AE3PSL004G0芯片 |
2026-01-08 |
New device added |
新增HYF8GQ4IACCBE芯片 |
2026-01-08 |
Optimized |
解决了FC511L08SFY3A 不稳定问题 |
2026-01-06 |
New device added |
新增 WINBOND W25Q01RV/W25Q02RV (IM) (IQ) (IN) |
2026-01-06 |
New device added |
新增 WINBOND W25Q33RV/W25Q64RV/W25Q12RV (IM) (IQ) (IN) |
2026-01-06 |
New device added |
新增 WINBOND W25Q25RV(IM) (IQ) (IN) |
2026-01-06 |
New device added |
新增 WINBOND W25Q51RV(IM) (IQ) (IN) |
2026-01-06 |
New device added |
新增GD5F4GQ6REY2G Gang-4算法 |