更新日期 |
更新类别 |
更新内容 |
|---|---|---|
2026-01-19 |
Bug fixed |
修正BWEFMI016GN929器件名称字符问题 |
2026-01-19 |
New device added |
新增FM25G01BI3芯片 |
2026-01-16 |
New device added |
增加ATMEL系列 ATTINY861A@TSSOP20 |
2026-01-14 |
New device added |
新增GE51AE3MSL008G0芯片 |
2026-01-14 |
New device added |
新增MT29F8G08ABACAWP单头 |
2026-01-14 |
New device added |
新增MT29F4G08ABADAWP单头 |
2026-01-14 |
New device added |
新增MT29F4G08ABAFAWP单头 |
2026-01-14 |
New device added |
新增BWEFMIO16GN929芯片 |
2026-01-13 |
New device added |
新增SC95F8572X20芯片 |
2026-01-13 |
New device added |
新增P25N01GHA芯片 |
2026-01-13 |
Optimized |
解决了GD5F4GQ6REY2G 部分座头烧录不稳定问题 |
2026-01-12 |
New device added |
新增F50D1G41LC芯片 |
2026-01-12 |
New device added |
新增F50D2G41KB芯片 |
2026-01-12 |
New device added |
新增F50L2G41KB芯片 |
2026-01-09 |
New device added |
新增GD5F4GM7REYIGR芯片 |
2026-01-09 |
New device added |
新增ASFC4G31M-51BIN芯片 |
2026-01-09 |
New device added |
新增GE51AE3PSL004G0芯片 |
2026-01-09 |
New device added |
新增客户定制THGAMVG8T13BAIL算法 |
2026-01-09 |
New device added |
新增客户定制THGAMSG9T15BAIL算法 |
2026-01-09 |
New device added |
新增GD5F4GM7UEYIGR芯片 |
2026-01-08 |
New device added |
新增HYF8GQ4IACCBE芯片 |
2026-01-08 |
Optimized |
解决了FC511L08SFY3A 不稳定问题 |
2026-01-06 |
New device added |
新增 WINBOND W25Q80PW/W25Q16PW/W25Q33PW |
2026-01-06 |
New device added |
新增GD5F4GQ6REY2G Gang-4算法 |
2026-01-06 |
New device added |
新增 WINBOND W25Q01RV/W25Q02RV (IM) (IQ) (IN) |